| Manufacturer | TDK InvenSense |
|---|---|
| Mfr. Part Number | ICM-20608-G |
| Electland Part Code | 997461 |
| Electland Part Number | NYE_ICM-20608-G |
| Category | Accelerometers |
| Description | Accelerometer, Gyroscope, 6 Axis Sensor I2C, SPI Output |
| Category | Sensors, Transducers Motion Sensors Accelerometers |
|---|---|
| Output Type | I2C, SPI |
| Voltage - Supply | 1.71V~3.45V |
| Features | Motion event detection |
| Operating Temperature | -40℃~+85℃ |
| Mounting Type | Surface Mount |
| Package / Case | 16-WFLGA Module |
| Supplier Device Package | 16-LGA (3x3) |
| interface | I2C;SPI |
| standby current | 6uA |
| Sensor Type | Accelerometer, Gyroscope, 6 Axis |
| Accelerometer Sensing Axis | X,Y,Z |
| Output Bits | 16bit |
| Cache Size | 0.5KB |
| Acceleration Measurement Range (MAX) | ±16g |
| Packaging | LGA-16(3x3) |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 3 (168 Hours) |
| ExportControlClassNumber | 7A994 |
| HtsusCode | 8542.39.0070 |
| Weight | 0.015g |
The ICM-20608-G is a 6-axis motion tracking device that integrates a 3-axis gyroscope and 3-axis accelerometer in a small 3×3×0.75mm (16-pin LGA) package. It also features a 512-byte FIFO that reduces serial bus interface traffic and lowers power consumption by allowing the system processor to burst-read sensor data and then enter low-power mode. The gyroscope has a user-programmable full-scale range of ±250, ±500, ±1000, and ±2000°/s, and the accelerometer has a user-programmable full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity for both sensors reduces production line calibration requirements. Additional features include an on-chip 16-bit ADC, programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device supports I²C and SPI serial interfaces, with a VDD operating range of 1.71 to 3.45V and a separate digital IO supply VDDIO ranging from 1.71V to 3.45V. All device registers can be accessed via I²C at 400kHz or SPI at 8MHz. By leveraging its patented and extensively validated CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has reduced the package size to 3×3×0.75mm (16-pin LGA), delivering an extremely compact yet high-performance, low-cost package. The device offers high robustness with 10000g shock reliability.
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $7.49 | 2,079,630 تومان |
| 10+ | $7.13 | 1,979,670 تومان |
| 30+ | $6.52 | 1,810,310 تومان |
| 100+ | $5.98 | 1,660,370 تومان |