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Product Attributes

Introduction

MA4P7452F-1072T is a surface mount PIN diode in a non-magnetic metal electrode leadless face (MELF) package. The device utilizes Macom's proven HIPAX technology to produce a low-inductance ceramic package free of ribbon bonds or whisker wires. The package contains a hard-glass-passivated CERMACHIP™ PIN chip with full-surface bonding at both cathode and anode to maximize surface area and achieve minimum electrical and thermal resistance. The package uses a non-magnetic plating process with extremely low magnetic permeability. The device is fully characterized for electrical and mechanical properties to ensure repeatable and predictable performance. The non-magnetic MA4P7452F-1072T is electrically equivalent to the magnetic MA4P7002F-1072T.

This diode is ideal for low-loss, low-distortion, high-power switching circuits operating in high magnetic field environments from HF to UHF frequencies. The device's low thermal resistance enables excellent performance at high RF power incident levels up to 100 watts CW. The device is designed to meet the most demanding electrical and mechanical MRI environmental requirements.

These SMQ PIN diodes are designed for high-volume tape-and-reel assembly. The rectangular package design is compatible with efficient automated pick-and-place assembly techniques. The parallel planes are suitable for pickup by gripper or vacuum nozzle. All solderable surfaces are tin-plated, compatible with reflow and vapor phase soldering methods.

Features

• Non-magnetic package for MRI applications
• Rectangular MELF SMQ ceramic package
• Hermetically sealed package
• Low Rs for low series loss
• Long tL for reduced intermodulation distortion
• Low CJ for high series isolation
• High average incident power handling capability
• RoHS compliant

Applications

• Industrial and Medical (ISM) band