Introduction
The LCH3519DV500 core module is a full-featured core module designed on the Hisilicon Hi3519DV500 chip platform, with dimensions of 35mm × 35mm. The module connects to the carrier board via 180-pin stamp holes, exposing the external pin signals of the Hi3519DV500 while balancing high reliability, low cost, and high flexibility. The module integrates CPU and DDR, with DDR using mainstream LPDDR4/LPDDR4X for lower power consumption and higher frequency, available in 1GB or 2GB configurations. Its interface design deeply integrates multi-modal sensing and industrial-grade expansion capabilities: the video interface supports 2-channel 4-lane MIPI CSI input, compatible with thermal infrared, structured light, or ToF sensors, enabling dual-light fusion processing of multi-stream 4K@30fps video, along with BT.1120, MIPI DSI, and HDMI 1.4 multi-format outputs supporting 4K display and multi-screen collaboration; the audio section integrates dual differential analog inputs, I2S digital interface, and intelligent 3A algorithms for high-fidelity voice interaction; the network and storage layer extends 5G or WiFi 6 modules via Gigabit Ethernet and USB 3.0, with dual SDIO 3.0 interfaces and SATA expansion to build a high-speed local storage solution; industrial control interfaces integrate 4x UART, 8x I2C, 15x PWM, and PCIe expansion capability, combined with LSADC voltage detection and RGB display control interface, comprehensively meeting multi-peripheral access and complex control requirements for smart manufacturing, intelligent transportation, and other scenarios. The core module supports four-channel sensor input with ISP image processing capability up to 4K@30fps, supporting 2-frame WDR, multi-level noise reduction, 6-axis stabilization, panoramic stitching, multi-spectral fusion, and various other traditional image enhancement and processing algorithms. It can also perform real-time noise reduction and other processing on input images via AI algorithms, delivering exceptional image processing capability. It also supports thermal infrared, active/passive binocular stereo 3D, and ToF sensor integration and processing. The Hi3519DV500 features a built-in dual-core A55 processor, providing efficient, rich, and flexible CPU resources to meet customer computing and control needs, and integrates a high-efficiency neural network inference engine delivering up to 2.5 TOPS INT8 neural network computing power, supporting mainstream neural network frameworks. In addition, a stable and easy-to-use SDK is provided to support customers in rapidly bringing products to mass production.
