Introduction
The LCH3516DV500 core module is a full-featured core module with dimensions of 35mm × 35mm. The connection between the core module and the baseboard uses 180-pin stamp holes, which expose external pin signals while balancing high reliability, low cost, and high flexibility. The module integrates a CPU and DDR. The DDR uses the mainstream market model LPDDR4/LPDDR4X, offering lower power consumption and higher operating frequencies, with optional 1GB or 2GB configurations. The interface design deeply integrates multi-modal I/O with industrial-grade expansion capabilities: the video interface supports two 4-lane MIPI CSI-2 inputs and BT.1120/BT.656 parallel output, with integrated LVDS/Sub-LVDS/HiSPI protocols to meet the requirements of dual-spectrum camera fusion systems and 4K-level display; the audio section features dual differential analog inputs, an 8-channel digital microphone array, and an I2S digital interface, combined with a 3A noise reduction algorithm for high-fidelity audio/video synchronization; the network and storage layer provides Gigabit Ethernet, USB 3.0 expansion, dual-channel DDR4/eMMC 5.1 storage, and dual SDIO 3.0 interfaces to support high-capacity storage and wireless communication expansion; industrial control interfaces include 4× UART, multi-channel I2C/SPI buses, 15× PWM, and programmable GPIO, with PCIe/SATA expansion enabling multi-peripheral access for complex industrial equipment — the overall architecture balances high performance with reliability. The core module integrates an efficient neural network inference unit supporting up to 2 TOPS INT8 compute performance, 2-channel sensor input, and image signal processing at up to 5MP @ 30fps. It supports 2-frame WDR, multi-level noise reduction, 6-axis optical image stabilization, multi-spectral fusion, and various other traditional image enhancement and processing algorithms, as well as real-time AI-based image denoising and processing, delivering exceptional image processing capabilities to users. It supports the integration and processing of thermal infrared, active/passive binocular stereo 3D, and time-of-flight sensors. A stable, easy-to-use SDK is provided to accelerate customers' product mass production.
