برد توسعه، کیت‌ و پروگرامر برد ارزیابی (Evaluation) برد و کیت‌ ارزیابی و نمایش عملکرد

Product Attributes

Introduction

THJP surface mount chips are designed to provide an electrically isolated thermally conductive path to a ground plane or heat sink while maintaining electrical isolation of the device. Built on an aluminum nitride substrate, the device is available in both tin-lead and lead-free full wraparound termination styles. The low capacitance characteristic makes it an ideal choice for high-frequency and thermal gradient applications. Custom sizes are available.

Features

• Electrically isolated thermal conductor
• High thermal conductivity aluminum nitride substrate
• Electrically insulating terminals
• Low capacitance
• Available with tin-lead or lead-free fully encapsulated terminals
• AEC-Q200 compliant

Applications

• Power Supplies and Converters
• RF Amplifiers
• Synthesizers
• Switch-Mode Power Supplies
• PIN and Laser Diodes
• Filters