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Product Attributes

Introduction

The 5.0SMDJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

Features

• Excellent clamping capability
• Low incremental surge resistance
• Typical current (IR) less than 5 μA when the minimum breakdown voltage (VBR) > 22 V
• High temperature to reflow soldering guaranteed: 260 ℃/40 s
• Breakdown voltage (VBR) at the maximum junction temperature (TJ) = Breakdown voltage (VBR) at 25 ℃ x (1 + αT x (TJ - 25)) (αT: Temperature Coefficient, typical value is 0.1%)
• Plastic package is flammability rated V - 0 per Underwriters Laboratories
• Meet MSL level1, per J - STD - 020, LF maximum peak of 260 ℃
• Matte tin lead–free plated
• Halogen free and RoHS compliant
• Pb - free E3 means 2nd level interconnect is Pb - free and the terminal finish material is tin(Sn) (IPC/JEDEC J - STD609A.01)
• 5000W peak pulse power capability at 10/1000 μs waveform, repetition rate (duty cycles): 0.01%
• For surface mounted applications to optimize board space
• Low profile package
• Typical failure mode is short from over - specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC - 61000 - 4 - 2 ESD 30kV(Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000 - 4 - 2
• EFT protection of data lines in accordance with IEC 61000 - 4 - 4
• Built - in strain relief
• Glass passivated chip junction
• Fast response time: typically less than 1.0ps from 0V to the minimum breakdown voltage (BV)

Applications

• Telecom
• Computer
• Industrial
• Consumer electronic applications