سنسور و مبدل سنسور و ترانسمیتر فشار

Product Attributes

Introduction

The High Accuracy Silicon Ceramic series is a piezoresistive silicon pressure sensor that provides ratiometric analog or digital output for reading pressure within a specified full-scale pressure span and temperature range. The series is fully calibrated and temperature compensated, using an onboard ASIC to compensate for sensor offset, sensitivity, temperature effects, and non-linearity. The pressure-calibrated output value update rate is approximately 1 kHz for analog and 2 kHz for digital. The series is calibrated over a temperature range of 0°C to 50°C. The sensor operating characteristics are based on a single supply voltage of 3.3 V DC or 5.0 V DC. These sensors measure absolute, gauge, or differential pressure. The absolute pressure version features an internal vacuum reference, with output proportional to pressure. The gauge pressure version references atmospheric pressure, providing an output proportional to changes in atmospheric pressure. The differential pressure version allows measurement of pressure between two pressure ports. These pressure sensors are designed for non-corrosive, non-ionic gases such as air and other dry gases. Available options extend the performance of these sensors to non-corrosive, non-ionic liquids for pressure ranges above 40 mbar, 4 kPa, or 20 inH₂O. All products are designed and manufactured in accordance with relevant standards.

Features

• Combines high sensitivity with high overpressure and burst pressure ratings alongside excellent stability — performance attributes rarely achievable together in a single product — providing greater flexibility in sensor implementation, reducing design requirements needed to protect the sensor, without sacrificing the ability to detect minute pressure changes.
• Excellent long-term stability: sensor stability remains high even after extended use and exposure to extreme temperatures, helping reduce system calibration requirements, improve system performance, and support system uptime by minimizing the need for sensor maintenance or replacement over the application lifetime.
• Total Error Band characterizes true sensor performance across the 0°C to 50°C compensated range, helping reduce the need to individually test and calibrate each sensor — lowering manufacturing time and process costs, improving system accuracy, and providing enhanced sensor interchangeability with minimal part-to-part variation.
• Exceptional accuracy reduces the software required to correct system inaccuracies, shortening system design time, helping avoid additional customer calibration, improving system efficiency, and simplifying software development.
• High burst pressure rating helps improve system reliability, reduce potential system downtime, and simplify the design process.
• Wide operating pressure range allows ultra-low pressure sensors to be used continuously at conditions well above the calibrated pressure range.
• Modular, flexible design with multiple package styles, pressure port configurations, and options simplifies integration into device manufacturer applications.
• Available pressure ranges from ±1.6 mbar to ±10 bar, ±160 Pa to ±1 MPa, and ±0.5 inH₂O to 150 psi, supporting a wide variety of unique applications.
• Meets MSL 1 requirements, allowing customers to avoid thermal and mechanical damage during reflow soldering and/or rework; permits indefinite storage in specified sealed moisture-barrier bags, simplifying storage and reducing waste; eliminates the need for extended pre-reflow baking; enables stable use shortly after reflow; supports lean manufacturing.
• Optional internal diagnostics reduce the need for redundant sensors in the system and detect most internal failures, including sensor rupture.
• Ultra-low power consumption reduces system power requirements, enabling longer battery life; optional sleep mode available for special requirements.
• Output: ratiometric analog; I2C- or SPI-compatible 14-bit digital output accelerates performance, reduces conversion requirements, and facilitates direct microprocessor interfacing.
• Miniature package with reduced PCB footprint.