آر اف (فرکانس رادیویی) و بی‌سیم ماژول‌ فرستنده‌گیرنده و مودم آر اف

Product Attributes

Introduction

The Thales PLAS9 wireless module is built for demanding, high performance IoT applications delivering LTE advanced connectivity under extreme conditions. With Cat. 6 LTE technology, the PLAS9 enables sizzling data speeds of 300 Mbit/s download and 50 Mbit/s uplink plus seamless fallback to 3G and 2G networks. Providing reliable coverage in RF noisy urban areas as well as locations where 4G is still developing, it is an ideal solution for industrial routers and gateways, digital signage, industrial mobile computers and tablets.

Features

• The PLAS9 provides global coverage and 3G/2G fallback on just two variants, the PLAS9-X and PLAS9-W.
• The module’s innovative RF concept enables extreme performance and sensitivity and connection stability.
• MIMO 2×2 antenna interfaces enable consistent performance and improved data speeds.
• With carrier aggregation, PLAS9 delivers enhanced peak user data rates and optimized use of spectrum for improved connectivity performance.
• Thales’s proprietary 156 LGA footprint enables optimized heat dissipation that prevents warping while allowing the freedom to select the most beneficial soldering paste and stencil height suited to each individual application.
• Extreme durability, long life components and a unique LGA form factor compatible with past and next generation wireless modules ensures easy migration between wireless standards from a single design, which helps to improve Total Cost of Ownership.
• A highly integrated RF design improves reliability and stability in harsh and fluctuating conditions providing excellent performance in noisy urban areas.
• Trusted partner to 450+ global MNOs ensures products evolve in sync with networks and modules are pre-certified for all global mobile networks.
• Core competency in MIM, SIM and eUICC technology allows simplified integration with modules and lower Total Cost of Ownership.
• Expert design consulting, local market engineering support and a skilled 24/7 help desk streamline development and deployment.
• Global leader in digital security solutions and platforms.
• Experienced provider of software solutions for Quality of Service and product life cycle management.
• Extensive RF test capabilities and GCF/PTCRB pretests to validate readiness for solution approval process.
• Regional variants: PLAS9-X: Hexa-Band LTE-Advanced FDD: 700 MHz (B12/B17, B13, B29), 850 MHz (B5),1700 MHz (B4), 1900 MHz (B2); PLAS9-W: Hendeka-Band LTE-Advanced FDD: 700 MHz (B28A, B28B), 800 MHz (B20), 850 MHz (B5, B18, B19, B26), 900 MHz (B8), 1800 MHz (B3), 2100 MHz (B1), 2600 MHz (B7) Quad-Band LTE-Advanced TDD: 1900 MHz (B39), 2300 MHz (B40), 2500 MHz (B41), 2600 MHz (B38).
• LTE (FDD 3GPP Release 12; 2×2 DL-MIMO).
• UMTS/HSPA (FDD) 3GPP Release 8; Rx diversity.
• GSM/GPRS/EDGE 3GPP Release 6; DARP/SAIC.
• SIM Application Toolkit, 3GPP release 99.
• Control via AT commands (Hayes, TS 27.007, TS 27.005).
• Supply voltage range 3.3 - 4.2 V, highly optimized for minimal power consumption.
• Dimension: 40×32×2.8 mm.
• Operating Temperature Range: -40 °C to +95 °C.
• RoHS, RED and REACH compliant, EuP support.
• USB 2.0/3.0 interface supports multiple composite modes and a Linux-/Mac- compliant mode.
• Firmware update via USB.
• 156 pad LGA mount.
• Pads for primary, secondary Antenna.
• USB 3.0 super speed (5 Gbps).
• 2 UICC (SIM/MIM) interfaces 1.8V / 3V.
• 10 programmable GPIOs including wake-up and low current indication, 2 ADCs.
• NDIS/USB driver for Microsoft Windows 7, Windows 8 and Windows 10.
• RIL driver for devices based on Android OS.
• R&TTE, GCF, CE, FCC, IC, PTCRB, UL California RoHS.
• AT&T, Telstra and Verizon operator approvals.
• Other local approvals and certifications on request.

Applications

• Industrial routers and gateways
• Digital signage
• Industrial mobile computers and tablets