آر اف (فرکانس رادیویی) و بی‌سیم ماژول‌ فرستنده‌گیرنده و مودم آر اف

Product Attributes

Introduction

The Sterling-LWB is a high performance 2.4 GHz WLAN and Bluetooth combo module based on latest-generation silicon (Broadcom’s BCM4343W). With an industrial temperature rating, broad country certifications, and the availability of three different package styles, the Sterling-LWB provides significant flexibility to meet various end user application needs. The on-module chip antenna package style for the Sterling-LWB eliminates complexity for design integration, simplifies manufacturing assembly with larger pin outs, and features an advanced chip antenna that offers greater resistance to de-tuning than typical trace or chip antennas. The module includes the MAC, Baseband and Radio to support WLAN applications and an independent, high-speed UART is provided for the Bluetooth host interface. In addition, the latest Linux and Android drivers are supported directly by LSR and Broadcom.

Features

• IEEE 802.11 b/g/n (single stream n) Typical WLAN Transmit Power:
  • +17.5 dBm, 11 Mbps, CCK (b)
  • +14.0 dBm, 54 Mbps, OFDM (g)
  • +12.5 dBm, HT20 MCS7 (n)
• Typical WLAN Sensitivity:
  • -88 dBm, 8% PER,11 Mbps (b)
  • -75 dBm, 10% PER, 54 Mbps (g)
  • -72 dBm, 10% PER, MCS7 (n)
• Bluetooth v4.2 BR /DR/LE
• WLAN and Bluetooth coexistence Available in two footprint styles:
  • Easy to Integrate: 15.5 mmx21 mm
  • Miniature footprint: 10 mmx10 mm
• Available with integrated chip antenna or U.FL connector for external antenna
• Operating voltage: 3.0V to 3.6V
• Operating temperature: -40℃ to +85℃
• Storage temperature: -40℃ to +125℃
• Compact design based on Broadcom BCM4343W SoC
• Worldwide acceptance: FCC (USA), IC (Canada), ETSI (Europe), Giteki (Japan), and RCM (AU/NZ)
• BT SIG QDID: 85005
• REACH and RoHS compliant

Applications

• Security & Building Automation
• Internet of Things / M2M Connectivity
• Smart Gateways