آر اف (فرکانس رادیویی) و بی‌سیم ماژول‌ فرستنده‌گیرنده و مودم آر اف

Product Attributes

Introduction

FCS960K is a high-performance Wi-Fi 6 and Bluetooth 5.4 LCC package module for WLAN and Bluetooth connectivity. The module complies with IEEE 802.11a/b/g/n/ac/ax protocols, supporting up to 11ax MCS 11 rates in 80 MHz channels with a throughput of up to 600.5 Mbps. The FCS960K features a reliable SDIO 3.0 interface for high-speed WLAN transmission.

The FCS960K has an ultra-compact form factor of 12.0 mm × 12.0 mm × 2.0 mm, optimizing the size and cost of end products and fully meeting the needs of size-sensitive applications.

SMT makes the FCS960K an ideal solution for durable and rugged designs. The low profile and small footprint of the LCC package ensure the FCS960K can be easily embedded in space-constrained applications while providing reliable connectivity. Advanced packaging, an integrated shield, and laser-engraved labels with improved thermal dissipation and indelible markings enable large-scale automated manufacturing with stringent cost and efficiency requirements. Combined with its compact dimensions and wide operating temperature range, the FCS960K meets diverse requirements across commercial and industrial applications.

Features

• 2.4 GHz/5 GHz Wi-Fi and Bluetooth 5.4
• Wi-Fi/Bluetooth antenna: 1 × 1
• SDIO 3.0 interface for higher data transfer rates and lower power consumption
• LCC package for easy soldering
• Faster time-to-market: simplified design minimizes design-in time and development effort
• Wide operating temperature range: -20 °C ~ +80 °C
• Compliant with IEEE 802.11 a/b/g/n/ac/ax
• Bluetooth 5.4 support
• LCC package
• SDIO 3.0 interface
• Ultra-compact form factor