آر اف (فرکانس رادیویی) و بی‌سیم آی سی‌ فرستنده‌گیرنده آر اف

Product Attributes

Introduction

The DA14531 is an ultra-low-power SoC integrating a 2.4 GHz transceiver and an Arm Cortex-M0+ microcontroller, with 48 kB of RAM and 32 kB of one-time programmable memory. The chip can be used as a standalone application processor or as a data pump in hosted systems. Its radio transceiver, baseband processor, and certified Bluetooth Low Energy stack are fully compliant with the Bluetooth LE 5.1 standard. The DA14531 features dedicated hardware for implementing the Bluetooth LE link layer and an interface controller for enhanced connectivity. Its Bluetooth LE firmware includes L2CAP service layer protocol, Security Manager, Attribute Protocol, Generic Attribute Profile, and Generic Access Profile, supporting all profiles published by the Bluetooth SIG as well as custom profiles. The DA14531-01 is optimized for peripheral-only applications, offering approximately 25% additional user RAM in typical Bluetooth LE applications compared to the DA14531-00, while remaining pin-compatible. The device is suitable for disposables, wireless sensor nodes, beacons, proximity tags and trackers, smart HID devices (styluses, keyboards, mice, and touchpads), toys, and medical and industrial applications.

Features

• Bluetooth 5.1 compliant, conforming to ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
• Up to 3 simultaneous Bluetooth LE connections
• Typical cold start to advertisable state: 35 ms
• Processing: 16 MHz 32-bit Arm Cortex-M0+ with SWD interface
• IoT benchmark score: 18300 EEMBC IoTMark-Bluetooth LE
• Dedicated link layer and AES-128 encryption processor
• Software-based true random number generator
• Memory: 32 kB OTP, 48 kB retained system RAM, 144 kB ROM
• Power management: integrated buck/boost DC-DC converter
• Buck mode: 1.8 V ≤ V_BAT_HIGH ≤ 3.6 V
• Boost mode: 1.1 V ≤ V_BAT_LOW ≤ 1.65 V
• Clockless sleep current: 270 nA (buck mode), 240 nA (boost mode)
• On-chip temperature sensor for die temperature monitoring
• Clocking: 32 MHz crystal and 32 MHz RC oscillator; 32 kHz crystal and 32/512 kHz RC oscillator; 15 kHz RCX oscillator as crystal alternative
• Programmable reset circuit
• 2 general-purpose timers with capture and PWM capability
• Digital interfaces: 6 GPIOs (WLCSP17) or 12 GPIOs (FCGQFN24); 2 UARTs (one with flow control); master/slave SPI up to 32 MHz (master mode); I2C supporting 100 kHz and 400 kHz; 3-axis quadrature decoder; keyboard controller
• Analog interface: 4-channel 10-bit ADC
• Radio transceiver: fully integrated 2.4 GHz CMOS transceiver, single-wire antenna
• TX current: 3.5 mA; RX current: 2.2 mA (system current with DC-DC converter, V_BAT_HIGH = 3 V, output power 0 dBm)
• Programmable TX output power: -19.5 dBm to +2.5 dBm
• RX sensitivity: -94 dBm
• Packages: WLCSP 17-ball, 1.7×2.05 mm, 0.5 mm pitch; FCGQFN 24-pin, 2.2×3 mm, 0.4 mm pitch
• Variants: 531-00 supports LE central and peripheral roles; 531-01 supports LE peripheral role only

Applications

• Medical applications
• Disposables
• Beacons
• Proximity tags and trackers
• Wireless sensor nodes
• Fitness trackers
• Consumer health devices
• Smartwatches
• Human interface devices
• Styluses
• Keyboards
• Mouse devices
• Touchpads
• Toys
• Industrial equipment