| Manufacturer | MACOM |
|---|---|
| Mfr. Part Number | MA4SW310B-1 |
| Electland Part Code | 282862 |
| Electland Part Number | NYE_MA4SW310B-1 |
| Category | RF Switches |
| Description | RF Switch IC General Purpose SP3T 18 GHz Die |
| Datasheet | Download |
| Category | RF and Wireless RF Switches |
|---|---|
| RF Type | General Purpose |
| Topology | Reflective |
| Circuit | SP3T |
| Frequency Range | 2GHz ~ 18GHz |
| Isolation | 40dB |
| Insertion Loss | 1.3dB |
| Test Frequency | 18GHz |
| Operating Temperature | -65°C ~ 125°C |
| Package / Case | Die |
| Supplier Device Package | Die |
| Packaging | Tray |
| Tariff Active | False |
| ReachStatus | REACH Unknown |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8541.10.0060 |
| Weight | 0.5g |
MA4SW310B-1 is a broadband switch with an integrated bias network, fabricated using MACOM's HMIC (Heterolithic Microwave Integrated Circuit) process based on U.S. Patent 5,268,310. This process embeds silicon posts in low-loss, low-dispersion glass to form series and shunt diodes or vias. Leveraging the tight spacing between circuit elements, this silicon-in-glass combination enables low loss and high isolation at low millimeter-wave frequencies, with excellent repeatability. The top surface of the die is coated with a polymer overcoat for ease of manual or automated handling, and large gold bond pads facilitate low-inductance ribbon connections. Gold metallization on the backside of the die allows die attach via 80/20 (Au/Sn) solder or conductive silver epoxy.
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $15.35 | 4,261,990 تومان |
| 200+ | $5.94 | 1,649,270 تومان |
| 500+ | $5.74 | 1,593,740 تومان |
| 1000+ | $5.63 | 1,563,190 تومان |