آر اف (فرکانس رادیویی) و بی‌سیم تضعیف‌کننده‌

Product Attributes

Introduction

These fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable. Custom values and configuration available on request. Front to back metallization in 4 places Bonding pad sizes and resistor outline may differ from value to value.

Features

• Medium Power Handling 2 W CW
• Flat Response from DC to 20 GHz
• Return Loss: >18 dB DC to 12 GHz >16 dB 13 to 20 GHz
• Space Saving Footprint: 0.030"×0.030" (0.762×0.762 mm)
• Very Good Stability Over Temperature (TRC < 100 PPM)
• Ground Wrap to Top (No ground bonding required)
• RoHS Compliant