| Manufacturer | Littelfuse/IXYS |
|---|---|
| Mfr. Part Number | CPC1788J |
| Electland Part Code | 259548 |
| Electland Part Number | NYE_CPC1788J |
| Category | Solid State Relays (SSR) |
| Description | Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™ |
| Datasheet | Download |
| Category | Relays Solid State Relays (SSR) |
|---|---|
| Mounting Type | Through Hole |
| Relay Type | Photo-Coupled Relay (Photorelay) |
| Circuit | SPST-NO (1 Form A) |
| Output Type | DC |
| Voltage - Input | 1.2VDC |
| Voltage - Load | 0 V ~ 1000 V |
| load current | 1 A |
| On-State Resistance (Max) | 1.25 Ohms |
| Termination Style | PC Pin |
| Operating Temperature | -40℃~+85℃ |
| Package / Case | ISOPLUS264™ |
| Supplier Device Package | ISOPLUS264™ |
| Approval Agency | CSA, TUV, UL |
| RDS(on) | 1Ω |
| Turn-on time | 2.85ms |
| Turn-off time | 110us |
| Isolation Voltage(Vrms) | 2.5kV |
| Input Type | DC |
| Forward Current(If) | 10mA |
| Contact Form | 1 Set Normally Open: 1A (SPST NO) |
| Forward voltage | 1.42V |
| Total Power Dissipation(Pd) | 150mW |
| Packaging | ISOPLUS-264 |
| Tariff Active | True |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8536.41.0030 |
| Weight | 0.0005g |
This series of new high-power solid-state relays utilizes OptoMOS technology, offering high reliability and a compact form factor. The CPC1788J is a single-pole normally open DC solid-state power relay that employs optically coupled MOSFET technology, providing 2500 Vrms input-to-output isolation. Its optically coupled output features the patented OptoMOS architecture, controlled by a high-efficiency infrared LED. The combination of low on-resistance and high load current handling capability makes it suitable for a wide range of high-performance DC switching applications. The unique ISOPLUS-264 package enables the solid-state relay to achieve the highest load current and power ratings. This package employs a unique process in which silicon dies are soft-soldered onto a direct bonded copper ceramic substrate rather than a conventional copper leadframe. The ceramic substrate not only provides 2500 Vrms isolation but also offers extremely low junction-to-case thermal impedance.
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $18.67 | 5,183,800 تومان |
| 10+ | $18.08 | 5,019,990 تومان |