| Manufacturer | Littelfuse/IXYS |
|---|---|
| Mfr. Part Number | CPC1968J |
| Electland Part Code | 259229 |
| Electland Part Number | NYE_CPC1968J |
| Category | Solid State Relays (SSR) |
| Description | Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™ |
| Datasheet | Download |
| Category | Relays Solid State Relays (SSR) |
|---|---|
| Mounting Type | Through Hole |
| Relay Type | Photo-Coupled Relay (Photorelay) |
| Circuit | SPST-NO (1 Form A) |
| Output Type | AC, DC |
| Voltage - Input | 1.2VDC |
| Voltage - Load | 0 V ~ 500 V |
| load current | 2 A |
| On-State Resistance (Max) | 350 mOhms |
| Termination Style | PC Pin |
| Operating Temperature | -40℃~+85℃ |
| Package / Case | ISOPLUS264™ |
| Supplier Device Package | ISOPLUS264™ |
| Approval Agency | CSA, TUV, UL |
| RDS(on) | 350mΩ |
| Turn-on time | 4.6ms |
| Turn-off time | 70us |
| Isolation Voltage(Vrms) | 2.5kV |
| Input Type | DC |
| Forward Current(If) | 2.45mA |
| Contact Form | 1 Set Normally Open: 1A (SPST NO) |
| Forward voltage | 1.35V |
| Total Power Dissipation(Pd) | 150mW |
| Packaging | SIP-4 |
| Tariff Active | True |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8536.41.0030 |
| Weight | 0.5g |
The CPC1968J single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 5A continuous load current with a 5°C/W heat sink. Optically coupled MOSFET technology enables the CPC1968J to provide 2500Vrms of input to output isolation. The output, constructed with efficient MOSFET switches and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process in which the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low junction-to-case thermal impedance (0.3°C/W).
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $15.93 | 4,423,030 تومان |
| 10+ | $15.45 | 4,289,760 تومان |