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LITTELFUSE/IXYS CPC1968J

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LITTELFUSE/IXYS CPC1968J

Manufacturer Littelfuse/IXYS
Mfr. Part Number CPC1968J
Electland Part Code 259229
Electland Part Number NYE_CPC1968J
Category Solid State Relays (SSR)
Description Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™
Datasheet Download

Product Attributes

Category Relays Solid State Relays (SSR)
Mounting Type Through Hole
Relay Type Photo-Coupled Relay (Photorelay)
Circuit SPST-NO (1 Form A)
Output Type AC, DC
Voltage - Input 1.2VDC
Voltage - Load 0 V ~ 500 V
load current 2 A
On-State Resistance (Max) 350 mOhms
Termination Style PC Pin
Operating Temperature -40℃~+85℃
Package / Case ISOPLUS264™
Supplier Device Package ISOPLUS264™
Approval Agency CSA, TUV, UL
RDS(on) 350mΩ
Turn-on time 4.6ms
Turn-off time 70us
Isolation Voltage(Vrms) 2.5kV
Input Type DC
Forward Current(If) 2.45mA
Contact Form 1 Set Normally Open: 1A (SPST NO)
Forward voltage 1.35V
Total Power Dissipation(Pd) 150mW
Packaging SIP-4
Tariff Active True
ReachStatus REACH Unaffected
RohsStatus ROHS3 Compliant
MoistureSensitivityLevel 1 (Unlimited)
ExportControlClassNumber EAR99
HtsusCode 8536.41.0030
Weight 0.5g

Introduction

The CPC1968J single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 5A continuous load current with a 5°C/W heat sink. Optically coupled MOSFET technology enables the CPC1968J to provide 2500Vrms of input to output isolation. The output, constructed with efficient MOSFET switches and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process in which the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low junction-to-case thermal impedance (0.3°C/W).

Features

  • 5A Load Current with 5°C/W Heat Sink
  • Low 0.35Ω On-Resistance
  • 500VP Blocking Voltage
  • 2500Vrms Input/Output Isolation
  • Low Thermal Impedance: θJC = 0.3 °C/W
  • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications
  • Low Drive Power Requirements
  • No EMI/RFI Generation
  • Flammability Rating UL 94 V-0

Applications

  • Industrial Controls / Motor Control
  • Robotics
  • Medical Equipment—Patient/Equipment Isolation
  • Instrumentation
  • Multiplexers
  • Data Acquisition
  • Electronic Switching
  • I/O Subsystems
  • Meters (Watt-Hour, Water, Gas)
  • Transportation Equipment

In-Stock Suppliers

NoyanElectronic
2 in stock
Supplier Part Number: NYE_CPC1968J

1 1
QTY USD TOMAN
1+$15.934,423,030 تومان
10+$15.454,289,760 تومان

Qty in reel: 25pcs/reel