| Manufacturer | Littelfuse/IXYS |
|---|---|
| Mfr. Part Number | CPC1927J |
| Electland Part Code | 259224 |
| Electland Part Number | NYE_CPC1927J |
| Category | Solid State Relays (SSR) |
| Description | Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™ |
| Datasheet | Download |
| Category | Relays Solid State Relays (SSR) |
|---|---|
| Mounting Type | Through Hole |
| Relay Type | Photo-Coupled Relay (Photorelay) |
| Circuit | SPST-NO (1 Form A) |
| Output Type | AC, DC |
| Voltage - Input | 1.2VDC |
| Voltage - Load | 0 V ~ 250 V |
| load current | 2.7 A |
| On-State Resistance (Max) | 200 mOhms |
| Termination Style | PC Pin |
| Operating Temperature | -40℃~+85℃ |
| Package / Case | ISOPLUS264™ |
| Supplier Device Package | ISOPLUS264™ |
| Approval Agency | CSA, TUV, UL |
| RDS(on) | 200mΩ |
| Turn-on time | 12ms |
| Turn-off time | 220us |
| Isolation Voltage(Vrms) | 2.5kV |
| Input Type | DC |
| Forward Current(If) | 10mA |
| Contact Form | 1 Set Normally Open: 1A (SPST NO) |
| Forward voltage | 1.35V |
| Total Power Dissipation(Pd) | 150mW |
| Packaging | SIP-4 |
| Tariff Active | True |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8536.41.0030 |
| Weight | 0.5g |
OptoMOS technology, reliability and compact size are brought to a new family of high-power Solid State Relays. As part of this family, the single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 6.7A continuous load current with a 5°C/W heat sink. The relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS - 264 package enables Solid State Relays to achieve the highest load current and power ratings. This package features a process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction - to - case thermal impedance (0.3°C/W).
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $11.31 | 3,140,270 تومان |
| 10+ | $10.97 | 3,045,870 تومان |