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LITTELFUSE/IXYS CPC1927J

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LITTELFUSE/IXYS CPC1927J

Manufacturer Littelfuse/IXYS
Mfr. Part Number CPC1927J
Electland Part Code 259224
Electland Part Number NYE_CPC1927J
Category Solid State Relays (SSR)
Description Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™
Datasheet Download

Product Attributes

Category Relays Solid State Relays (SSR)
Mounting Type Through Hole
Relay Type Photo-Coupled Relay (Photorelay)
Circuit SPST-NO (1 Form A)
Output Type AC, DC
Voltage - Input 1.2VDC
Voltage - Load 0 V ~ 250 V
load current 2.7 A
On-State Resistance (Max) 200 mOhms
Termination Style PC Pin
Operating Temperature -40℃~+85℃
Package / Case ISOPLUS264™
Supplier Device Package ISOPLUS264™
Approval Agency CSA, TUV, UL
RDS(on) 200mΩ
Turn-on time 12ms
Turn-off time 220us
Isolation Voltage(Vrms) 2.5kV
Input Type DC
Forward Current(If) 10mA
Contact Form 1 Set Normally Open: 1A (SPST NO)
Forward voltage 1.35V
Total Power Dissipation(Pd) 150mW
Packaging SIP-4
Tariff Active True
ReachStatus REACH Unaffected
RohsStatus ROHS3 Compliant
MoistureSensitivityLevel 1 (Unlimited)
ExportControlClassNumber EAR99
HtsusCode 8536.41.0030
Weight 0.5g

Introduction

OptoMOS technology, reliability and compact size are brought to a new family of high-power Solid State Relays. As part of this family, the single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 6.7A continuous load current with a 5°C/W heat sink. The relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS - 264 package enables Solid State Relays to achieve the highest load current and power ratings. This package features a process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction - to - case thermal impedance (0.3°C/W).

Features

  • 6.7Arms Load Current with 5°C/W Heat Sink
  • Low 0.2Ω On - Resistance
  • 250VP Blocking Voltage
  • 2500Vrms Input/Output Isolation
  • Low Thermal Impedance: θJC = 0.3°C/W
  • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications
  • Low Drive Power Requirements
  • No EMI/RFI Generation
  • Flammability Rating UL 94 V - 0

Applications

  • Industrial Controls / Motor Control
  • Robotics
  • Medical Equipment—Patient/Equipment Isolation
  • Instrumentation
  • Multiplexers
  • Data Acquisition
  • Electronic Switching
  • I/O Subsystems
  • Meters (Watt - Hour, Water, Gas)
  • Transportation Equipment

In-Stock Suppliers

NoyanElectronic
0 in stock
Supplier Part Number: NYE_CPC1927J

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QTY USD TOMAN
1+$11.313,140,270 تومان
10+$10.973,045,870 تومان

Qty in reel: 25pcs/reel