| Manufacturer | Littelfuse/IXYS |
|---|---|
| Mfr. Part Number | CPC1918J |
| Electland Part Code | 259074 |
| Electland Part Number | NYE_CPC1918J |
| Category | Solid State Relays (SSR) |
| Description | Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™ |
| Datasheet | Download |
| Category | Relays Solid State Relays (SSR) |
|---|---|
| Mounting Type | Through Hole |
| Relay Type | Photo-Coupled Relay (Photorelay) |
| Circuit | SPST-NO (1 Form A) |
| Output Type | AC, DC |
| Voltage - Input | 1.2VDC |
| Voltage - Load | 0 V ~ 100 V |
| load current | 5.25 A |
| On-State Resistance (Max) | 100 mOhms |
| Termination Style | PC Pin |
| Operating Temperature | -40℃~+85℃ |
| Package / Case | ISOPLUS264™ |
| Supplier Device Package | ISOPLUS264™ |
| Approval Agency | CSA, TUV, UL |
| RDS(on) | 100mΩ |
| Turn-on time | 12ms |
| Turn-off time | 260us |
| Isolation Voltage(Vrms) | 2.5kV |
| Forward Current(If) | 10mA |
| Forward voltage | 1.42V |
| Packaging | ISOPLUS-264 |
| Tariff Active | True |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8536.41.0030 |
| Weight | 0.0005g |
OptoMOS technology, reliability and compact size are brought to a new family of high-power Solid State Relays. The CPC1918J single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 13 A continuous load current with a 5℃/W heat sink. The CPC1918J employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique process in which the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.3℃/W).
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $8.18 | 2,271,210 تومان |
| 10+ | $7.82 | 2,171,260 تومان |
| 30+ | $7.21 | 2,001,890 تومان |
| 100+ | $6.67 | 1,851,950 تومان |