| Manufacturer | Littelfuse/IXYS |
|---|---|
| Mfr. Part Number | CPC1709J |
| Electland Part Code | 258869 |
| Electland Part Number | NYE_CPC1709J |
| Category | Solid State Relays (SSR) |
| Description | Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™ |
| Datasheet | Download |
| Category | Relays Solid State Relays (SSR) |
|---|---|
| Mounting Type | Through Hole |
| Relay Type | Photo-Coupled Relay (Photorelay) |
| Circuit | SPST-NO (1 Form A) |
| Output Type | DC |
| Voltage - Input | 1.2VDC |
| Voltage - Load | 0 V ~ 60 V |
| load current | 9 A |
| On-State Resistance (Max) | 50 mOhms |
| Termination Style | PC Pin |
| Operating Temperature | -40℃~+85℃ |
| Package / Case | ISOPLUS264™ |
| Supplier Device Package | ISOPLUS264™ |
| Approval Agency | CSA, TUV, UL |
| RDS(on) | 27mΩ |
| Turn-on time | 7ms |
| Turn-off time | 220us |
| Isolation Voltage(Vrms) | 2.5kV |
| Input Type | DC |
| Forward Current(If) | 10mA |
| Contact Form | 1 Set Normally Open: 1A (SPST NO) |
| Forward voltage | 1.42V |
| Packaging | ISOPLUS-264 |
| Tariff Active | True |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8536.41.0030 |
| Weight | 0.0005g |
OptoMOS technology, reliability and compact size to a new family of high-power Solid State Relays.
As part of this family, the CPC1709J single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.
The output, constructed with an efficient MOSFET switch and photovoltaic die, uses patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications.
The unique ISOPLUS - 264 package enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction - to - case thermal impedance (0.3℃/W).
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $5.08 | 1,410,480 تومان |
| 10+ | $4.45 | 1,235,560 تومان |
| 30+ | $4.07 | 1,130,050 تومان |
| 100+ | $3.75 | 1,041,200 تومان |