| Manufacturer | Littelfuse/IXYS |
|---|---|
| Mfr. Part Number | CPC1779J |
| Electland Part Code | 258807 |
| Electland Part Number | NYE_CPC1779J |
| Category | Solid State Relays (SSR) |
| Description | Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) ISOPLUS264™ |
| Datasheet | Download |
| Category | Relays Solid State Relays (SSR) |
|---|---|
| Mounting Type | Through Hole |
| Relay Type | Photo-Coupled Relay (Photorelay) |
| Circuit | SPST-NO (1 Form A) |
| Output Type | DC |
| Voltage - Input | 1.2VDC |
| Voltage - Load | 0 V ~ 600 V |
| load current | 1.65 A |
| On-State Resistance (Max) | 400 mOhms |
| Termination Style | PC Pin |
| Operating Temperature | -40℃~+85℃ |
| Package / Case | ISOPLUS264™ |
| Supplier Device Package | ISOPLUS264™ |
| Approval Agency | CSA, TUV, UL |
| RDS(on) | 300mΩ |
| Turn-on time | 6.5ms |
| Turn-off time | 160us |
| Isolation Voltage(Vrms) | 2.5kV |
| Input Type | DC |
| Forward Current(If) | 2.1mA |
| Contact Form | 1 Set Normally Open: 1A (SPST NO) |
| Forward voltage | 1.42V |
| Total Power Dissipation(Pd) | 150mW |
| Packaging | ISOPLUS-264 |
| Tariff Active | True |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8536.41.0030 |
| Weight | 0.0005g |
IXYS Integrated Circuits brings PhotoMOS technology, reliability, and compact size to a new family of high-power solid state relays. As part of this new family, the CPC1779J single-pole normally open (1-Form-A) DC solid state power relay uses optically coupled MOSFET technology to provide 2500Vrms input-to-output isolation. The optically coupled output employs a patented PhotoMOS architecture controlled by a high-efficiency infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a wide range of high-performance DC switching applications. IXYS's unique ISOPLUS-264 package — a pioneering innovation — enables solid state relays to achieve the highest load current and power ratings. This package uses a unique IXYS process that solders silicon die to a Direct Copper Bonding (DCB) substrate rather than a conventional copper lead frame. The DCB ceramic is the same substrate used in high-power modules, providing not only 2500Vrms isolation but also an extremely low junction-to-case thermal resistance of 0.3℃/W.
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $6.99 | 1,940,800 تومان |
| 10+ | $6.64 | 1,843,620 تومان |
| 30+ | $6.03 | 1,674,250 تومان |
| 100+ | $5.5 | 1,527,100 تومان |