| Manufacturer | Littelfuse/IXYS |
|---|---|
| Mfr. Part Number | CPC1908J |
| Electland Part Code | 258805 |
| Electland Part Number | NYE_CPC1908J |
| Category | Solid State Relays (SSR) |
| Description | Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) i4-Pac™-4, Isolated |
| Datasheet | Download |
| Category | Relays Solid State Relays (SSR) |
|---|---|
| Mounting Type | Through Hole |
| Relay Type | Photo-Coupled Relay (Photorelay) |
| Circuit | SPST-NO (1 Form A) |
| Output Type | AC, DC |
| Voltage - Input | 1.2VDC |
| Voltage - Load | 0 V ~ 60 V |
| load current | 3.5 A |
| On-State Resistance (Max) | 300 mOhms |
| Termination Style | PC Pin |
| Operating Temperature | -40℃~+85℃ |
| Package / Case | i4-Pac™-4, Isolated |
| Supplier Device Package | i4-PAC™ |
| Approval Agency | CSA, TUV, UL |
| RDS(on) | 90mΩ |
| Turn-on time | 16ms |
| Turn-off time | 170us |
| Isolation Voltage(Vrms) | 2.5kV |
| Input Type | DC |
| Forward Current(If) | 10mA |
| Contact Form | 1 Set Normally Open: 1A (SPST NO) |
| Forward voltage | 1.42V |
| Total Power Dissipation(Pd) | 150mW |
| Packaging | i4-PAC |
| Tariff Active | True |
| ReachStatus | REACH Unaffected |
| RohsStatus | ROHS3 Compliant |
| MoistureSensitivityLevel | 1 (Unlimited) |
| ExportControlClassNumber | EAR99 |
| HtsusCode | 8536.41.0030 |
| Weight | 0.0005g |
IXYS Integrated Circuits has brought PhotoMOS technology, reliability, and compact dimensions to a new family of high-power solid-state relays. As part of this series, the CPC1908J single-pole normally open (1-Form-A) solid-state power relay is rated for a continuous load current of 8.5Arms with a 5°C/W heatsink. The CPC1908J employs optically coupled MOSFET technology to provide 2500Vrms input-to-output isolation. The optically coupled output utilizes a patented PhotoMOS architecture controlled by a high-efficiency infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a wide range of high-performance switching applications. IXYS's unique i4-PAC package enables the solid-state relay to achieve the highest load current and power ratings. This package uses a unique IXYS process that soft-solders silicon die onto a Direct Copper Bonding (DCB) substrate rather than a conventional copper leadframe. The DCB ceramic substrate — the same type used in high-power modules — provides not only 2500Vrms isolation but also a very low junction-to-case thermal resistance of 0.35°C/W.
| QTY | USD | TOMAN |
|---|---|---|
| 1+ | $5.38 | 1,493,780 تومان |
| 10+ | $5.11 | 1,418,810 تومان |
| 30+ | $4.65 | 1,291,090 تومان |
| 100+ | $4.24 | 1,177,250 تومان |