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LITTELFUSE/IXYS CPC1908J

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LITTELFUSE/IXYS CPC1908J

Manufacturer Littelfuse/IXYS
Mfr. Part Number CPC1908J
Electland Part Code 258805
Electland Part Number NYE_CPC1908J
Category Solid State Relays (SSR)
Description Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) i4-Pac™-4, Isolated
Datasheet Download

Product Attributes

Category Relays Solid State Relays (SSR)
Mounting Type Through Hole
Relay Type Photo-Coupled Relay (Photorelay)
Circuit SPST-NO (1 Form A)
Output Type AC, DC
Voltage - Input 1.2VDC
Voltage - Load 0 V ~ 60 V
load current 3.5 A
On-State Resistance (Max) 300 mOhms
Termination Style PC Pin
Operating Temperature -40℃~+85℃
Package / Case i4-Pac™-4, Isolated
Supplier Device Package i4-PAC™
Approval Agency CSA, TUV, UL
RDS(on) 90mΩ
Turn-on time 16ms
Turn-off time 170us
Isolation Voltage(Vrms) 2.5kV
Input Type DC
Forward Current(If) 10mA
Contact Form 1 Set Normally Open: 1A (SPST NO)
Forward voltage 1.42V
Total Power Dissipation(Pd) 150mW
Packaging i4-PAC
Tariff Active True
ReachStatus REACH Unaffected
RohsStatus ROHS3 Compliant
MoistureSensitivityLevel 1 (Unlimited)
ExportControlClassNumber EAR99
HtsusCode 8536.41.0030
Weight 0.0005g

Introduction

IXYS Integrated Circuits has brought PhotoMOS technology, reliability, and compact dimensions to a new family of high-power solid-state relays. As part of this series, the CPC1908J single-pole normally open (1-Form-A) solid-state power relay is rated for a continuous load current of 8.5Arms with a 5°C/W heatsink. The CPC1908J employs optically coupled MOSFET technology to provide 2500Vrms input-to-output isolation. The optically coupled output utilizes a patented PhotoMOS architecture controlled by a high-efficiency infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a wide range of high-performance switching applications. IXYS's unique i4-PAC package enables the solid-state relay to achieve the highest load current and power ratings. This package uses a unique IXYS process that soft-solders silicon die onto a Direct Copper Bonding (DCB) substrate rather than a conventional copper leadframe. The DCB ceramic substrate — the same type used in high-power modules — provides not only 2500Vrms isolation but also a very low junction-to-case thermal resistance of 0.35°C/W.

Features

  • Load current 8.5Arms with 5℃/W heatsink
  • Low on-resistance 0.3Ω
  • Blocking voltage 60Vp
  • Input/output isolation 2500Vrms
  • Low thermal resistance: θJC = 0.35℃/W
  • Isolated, low thermal resistance ceramic pad for heatsink applications
  • Low drive power requirement
  • No EMI/RFI generation
  • Flammability rating UL 94 V-0

Applications

  • Industrial control / motor control
  • Robotics
  • Medical equipment - patient/device isolation
  • Instrumentation
  • Multiplexers

In-Stock Suppliers

NoyanElectronic
92 in stock
Supplier Part Number: NYE_CPC1908J

1 1
QTY USD TOMAN
1+$5.381,493,780 تومان
10+$5.111,418,810 تومان
30+$4.651,291,090 تومان
100+$4.241,177,250 تومان

Qty in reel: 25pcs/reel