رله‌ رله‌های سیگنال

Product Attributes

Introduction

• Ultra-compact dimensions (5.2mm H × 6.5mm W × 10.0mm L) for high-density PCB mounting (G6K(U)-2F(-Y) series).
• Low-profile height (5.2mm) significantly improves packaging density.
• Lightweight (approx. 0.7g) suitable for high-speed automated placement.
• High sensitivity: 100mW power consumption, a 70% reduction compared to conventional models.
• Innovative terminal structure ensures high IR irradiation efficiency, facilitating terminal temperature rise for superior solderability during IR reflow (SMT types).
• Dielectric strength: 1,500 VAC between coil and contacts.
• Surge withstand voltage: 1.5 kV (10 × 160 μs) per FCC Part 68 standard.
• Y-series available with optimized terminal spacing for surge withstand up to 2.5 kV (2 × 10 μs).
• Standards & Certification: UL/CSA and BSI (EN 62368-1) certified.
• Contact carry current: 2 A.
• Terminal pitch options: 2.54mm available.

Features

• 5.2mm (H) × 6.5mm (W) × 10mm (L), ultra-compact, suitable for high-density packaging
• 5.2mm height, low-profile design, improved packaging efficiency
• Approx. 0.7g, lightweight, suitable for higher-speed packaging
• 70% lower power consumption compared to previous products, 100mW high sensitivity
• Innovative terminal structure with high infrared irradiation efficiency; terminal temperature rises easily during IRS packaging, ensuring excellent solderability (surface-mount terminal type)
• Coil-to-contact withstand voltage AC 1,500V, impulse withstand voltage 1.5kV 10×160μs (FCC Part 68 standard)
• Optimized coil-to-contact terminal spacing; Y-series impulse withstand voltage up to 2.5kV 2×10μs
• Standard type certified to UL/CSA and BSI (EN62368-1)
• Available with 2.54mm terminal pitch option
• Supports contact carrying current of 2A

Applications

• Communication equipment
• OA equipment
• Test & measurement instruments
• Surveillance equipment
• Safety devices
• Building automation systems
• Industrial equipment