اپتوالکترونیک ماتریس و خوشهٔ ال‌ای‌دی

Product Attributes

Introduction

Wave soldering profile for through-hole products (lead-free components). Recommended preheat temperature is 105°C or lower (measured by thermocouple attached to LED leads), with a maximum solder pot temperature of 260°C before immersion in the solder wave. Wave soldering peak temperature is maintained at ≥45°C ~ 255°C for 3 seconds (5 seconds maximum). Do not stress the epoxy resin when temperature is above 85°C. During mounting and soldering, fixtures must not place stress on the component. SAC 305 solder alloy is recommended. Number of wave soldering passes must not exceed one. If special binning is required (e.g., sorting by forward voltage, luminous intensity/luminous flux, or wavelength), typical accuracy of the binning process is as follows: wavelength ±1nm, luminous intensity/luminous flux ±15%, forward voltage ±0.1V. Accuracy may depend on binning parameters.