اپتوالکترونیک نمایشگر کاراکتری و عددی ال ای دی

Product Attributes

Introduction

Forward current vs. forward voltage; forward current vs. ambient temperature; luminous intensity vs. ambient temperature

Features

• All dimensions in millimeters (inches)
• Unless otherwise specified, tolerance is ±0.25mm (0.01 inch)
• Specifications subject to change without notice
• When soldering LEDs, maintain a minimum distance of 3mm from the base of the epoxy bulb; soldering beyond the tie bar base is recommended
• Recommended soldering conditions
• Do not apply any stress to the leads, especially during heating
• Do not reposition the LED after soldering
• After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED returns to room temperature
• Direct soldering to PC boards should be avoided; PC board warpage or clamping and cutting of the lead frame may cause mechanical stress to the resin. If absolutely necessary, LEDs may be mounted in this manner, but the user assumes full responsibility for any issues. Direct soldering should only be performed after testing confirms that no damage such as wire bond failure or resin degradation will occur. LEDs should not be soldered directly to double-sided PC boards, as heat may cause epoxy degradation
• When clamping LEDs to prevent soldering failures, it is important to minimize mechanical stress on the LED
• Cut the LED lead frame at room temperature; cutting the lead frame at elevated temperatures may cause LED failure