اپتوالکترونیک نمایشگر کاراکتری و عددی ال ای دی

Product Attributes

Introduction

Forward current vs. forward voltage characteristics; forward current vs. ambient temperature characteristics; luminous intensity vs. ambient temperature characteristics

Features

• Solder no closer than 3mm from the base of the epoxy bulb; soldering beyond the bottom of the tie bar is recommended.
• Follow the recommended soldering conditions.
• Do not apply any stress to the leads, especially during heating.
• Do not reposition the LED after soldering.
• After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED has returned to room temperature.
• Direct soldering to a PC board should be avoided, as PC board warpage or clamping and cutting of the lead frame may cause mechanical stress to the resin. If direct soldering is necessary, the user assumes responsibility for any issues, and it should only be performed after testing confirms that no damage such as wire bond failure or resin degradation will occur. LEDs should not be soldered directly to double-sided PC boards, as heat may degrade the epoxy.
• When clamping LEDs to prevent soldering failures, minimize mechanical stress on the LED.
• Cut the LED lead frame at room temperature; cutting at elevated temperatures may cause LED failure.