اپتوالکترونیک نمایشگر کاراکتری و عددی ال ای دی

Product Attributes

Introduction

Forward current vs. forward voltage; forward current vs. ambient temperature; luminous intensity vs. ambient temperature

Features

• Solder no closer than 3mm from the base of the epoxy bulb; soldering beyond the tie bar base is recommended.
• Follow the recommended soldering conditions.
• Do not apply any stress to the leads, especially during heating.
• Do not reposition the LED after soldering.
• After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED returns to room temperature.
• Direct soldering to a PC board should be avoided. PC board warpage or clamping and cutting of the lead frame may cause mechanical stress to the resin. If this is truly necessary, the user assumes responsibility for any issues. Direct soldering should only be performed after testing confirms that no damage such as wire bond failure or resin degradation will occur. LEDs should not be soldered directly to double-sided PC boards, as heat may degrade the epoxy resin.
• When clamping the LED to prevent soldering failure, it is important to minimize mechanical stress on the LED.
• Cut the LED lead frame at room temperature. Cutting the lead frame at elevated temperatures may cause LED failure.