اپتوالکترونیک نمایشگر کاراکتری و عددی ال ای دی

Product Attributes

Introduction

Forward current vs. forward voltage; luminous intensity vs. ambient temperature

Features

• All dimensions in millimeters (inches)
• Unless otherwise specified, tolerance is ±0.25mm (0.01 inch)
• Specifications subject to change without notice
• When soldering LEDs, maintain a minimum distance of 3mm from the base of the epoxy bulb; soldering beyond the base of the tie bar is recommended
• Recommended soldering conditions
• Do not apply any stress to the leads, especially during heating
• Do not reposition LEDs after soldering
• After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED returns to room temperature
• Direct soldering to PC boards should be avoided; warping of the PC board or clamping and cutting of the lead frame may cause mechanical stress to the resin. If it is necessary to mount LEDs in this manner, the user assumes responsibility for any issues. Direct soldering may only be performed after testing confirms that no damage such as wire bond failure or resin degradation will occur. Do not solder LEDs directly to double-sided PC boards, as heat may cause epoxy degradation
• When clamping LEDs to prevent soldering failure, it is important to minimize mechanical stress on the LED
• Cut the LED lead frame at room temperature; cutting at elevated temperatures may cause LED failure