اپتوالکترونیک نمایشگر کاراکتری و عددی ال ای دی

Product Attributes

Features

• All dimensions in millimeters (inches)
• Tolerances ±0.25mm (0.01 inch) unless otherwise specified
• Solder no closer than 3mm from the base of the epoxy bulb; recommended soldering point is beyond the bottom of the tie bar
• Recommended specific soldering conditions apply
• Do not apply any stress to the leads, especially during heating
• Do not reposition LEDs after soldering
• After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED returns to room temperature
• Direct soldering to PC boards should be avoided, as PC board warpage or clinching and cutting of the lead frame may impose mechanical stress on the resin. If necessary, the user assumes responsibility for any issues and should only proceed after testing confirms no damage such as wire bond failure or resin degradation will occur. LEDs should not be soldered directly to double-sided PC boards, as heat may degrade the epoxy
• When clamping LEDs to prevent soldering failure, minimize mechanical stress on the LED as much as possible
• Cut the LED lead frame at room temperature; cutting at elevated temperatures may cause LED failure