اپتوالکترونیک نمایشگر کاراکتری و عددی ال ای دی

Product Attributes

Features

• Tolerance ±0.25mm (0.01") unless otherwise specified
• Specifications subject to change without notice
• Solder no closer than 3mm from the base of the epoxy bulb; soldering beyond the bottom of the tie bar is recommended
• Recommended soldering conditions
• Do not apply any stress to the leads, especially during heating
• Do not reposition the LED after soldering
• After soldering, protect the epoxy bulb from mechanical shock or vibration until the LED has returned to room temperature
• Avoid soldering directly to a PC board, as PC board warpage or clamping and cutting of the lead frame may cause mechanical stress to the resin. If direct mounting is necessary, the user assumes responsibility for any issues. Direct soldering should only be performed after testing confirms no damage such as wire bond failure or resin degradation will occur. LEDs should not be soldered directly to double-sided PC boards, as heat may cause epoxy degradation
• When clamping the LED to prevent soldering failure, minimize mechanical stress on the LED
• Cut the LED lead frame at room temperature; cutting at elevated temperatures may cause LED failure