ایزولاتور ایزولاتور دیجیتال

Product Attributes

Introduction

The ISOW77xx device family is a quad-channel digital isolator with an integrated high-efficiency power converter featuring low emissions. The integrated DC/DC converter provides up to 550mW of isolated power, eliminating the need for a separate isolated power supply in space-constrained isolation designs. The power converter operates efficiently across a wide ambient temperature range of –40°C to +125°C. The device offers improved emissions performance, simplifies board design, and supports ferrite beads for further emission attenuation. The ISOW774x is designed with enhanced protection features, including soft-start for inrush current limiting, overvoltage and undervoltage lockout, fault detection on the EN/FLT pin, overload and short-circuit protection, and thermal shutdown. The ISOW77xx family provides high electromagnetic immunity while isolating CMOS or LVCMOS digital I/O. The signal isolation channels feature logic input and output buffers separated by a dual-capacitor silicon dioxide (SiO₂) dielectric barrier, while power isolation uses an on-chip transformer with thin-film polymer as the insulation material. The quad-channel ISOW77xx is available in five orderable configurations, where the last digit of the device part number indicates the number of reverse channels. For example, the ISOW7740 has 4 forward channels and 0 reverse channels, while the ISOW7743 has 1 forward channel and 3 reverse channels. If the input signal is lost, ISOW77xx devices without the F suffix default to a logic-high output, while those with the F suffix default to a logic-low output. By connecting V₁₀ and VDD together on the PCB, the ISOW774x can operate from a single supply of 3V to 5.5V. For lower logic levels, these devices support a logic supply (V₁₀) of 1.71V to 5.5V, independent of the 3V to 5.5V power converter supply (VDD). VISOIN and VISOOUT must be connected to the board through a ferrite bead or fed through an LDO. These devices help prevent noise currents on data buses (e.g., UART, SPI, RS-485, RS-232, and CAN) or other circuits from entering the local ground and interfering with or damaging sensitive circuits. Through innovative chip design and routing techniques, the device's EMC performance is significantly enhanced, mitigating system-level ESD, EFT, surge, and radiated emissions compliance. The device is available in a 20-pin wide-body SOIC (SOIC-WB) DFM package.

Features

• 100 Mbps data rate
• Low-emission, low-noise integrated DC/DC converter optimized for CISPR 32 and EN 55032 Class B compliance, with margin > 5dB on 2-layer PCB
• 25 MHz low-frequency power converter for low-noise performance
• Low output ripple: 24mV
• High-efficiency output power
• Efficiency at maximum load: 46%
• Output power up to 0.55W
• VISOOUT accuracy: 5%
• 5V to 5V: maximum available load current = 110mA
• 5V to 3.3V: maximum available load current = 140mA
• 3.3V to 3.3V: maximum available load current = 60mA
• Separate supplies for channel isolator and power converter
• Logic supply (V₁₀): 1.71V to 5.5V
• Power converter supply (VDD): 3V to 5.5V
• Excellent EMC performance
• System-level ESD, EFT, and surge immunity
• ±8kV IEC 61000-4-2 contact discharge protection across the isolation barrier
• Enhanced and basic isolation options
• High CMTI: 100 kV/µs (typical)
• Safety-related certifications:
• VDE enhanced and basic insulation per DIN VDE V 0884-11:2017-01
• UL 1577 component recognition program
• IEC 62368-1, IEC 61010-1, IEC 60601-1, and GB 4943.1-2011 certifications
• ISOW774xB devices in plan
• 20-pin wide-body SOIC package

Applications

• Factory Automation
• Motor Control
• Power Grid Infrastructure
• Medical Equipment
• Test and Measurement