ایزولاتور ایزولاتور دیجیتال

Product Attributes

Introduction

The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates iCoupler technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 KVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm×6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation).

Features

• 5.7 kV rms and 1.5 kV rms LVDS isolators
• Complies with TIA/EIA-644-A LVDS signal levels
• Quad-channel configuration
• Any data rate up to 2.5 Gbps switching with low jitter
• 10 Gbps total bandwidth across four channels
• 2.15 ns typical propagation delay
• Typical jitter: 0.82 ps rms random, 40 ps total peak
• Lower power 1.8 V supplies
• ±8 kV IEC 61000-4-2 ESD protection across isolation barrier
• High common-mode transient immunity: 100 kV/μs typical
• Safety and regulatory approvals (28-lead SOIC_W_FP package)
• UL (pending): 5700 V rms for 1 minute per UL 1577
• CSA Component Acceptance Notice 5A (pending)
• VDE certificate of conformity (pending)
• DIN V VDE V 0884-11 (VDE V 0884-11):2017-01
• Enable or disable refresh (low speed output correctness check)
• Operating temperature range: -40°C to +125°C
• 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm×6 mm LFCSP package with 1.27 mm creepage and clearance

Applications

• Isolated video and imaging data
• Analog front-end isolation
• Data plane isolation
• Isolated high speed clock and data links
• Multi-gigabit serialization/deserialization (SERDES)
• Board-to-board optical replacement (for example, short reach fiber)