مدار مجتمع (آی سی) آی سی‌کاربرد ویژه

Product Attributes

Introduction

The AD5560 is a high-performance, highly integrated device power supply that provides programmable drive voltage and measurement ranges. The device includes the required DAC levels for setting programmable inputs to the drive amplifier, along with clamp and comparator circuits. On-chip bias and gain correction for DAC functionality is integrated. It offers multiple programmable measurement current ranges, including five internal fixed ranges and two additional externally selectable ranges (EXTFORCE1 and EXTFORCE2) providing up to ±1.2 A and ±500 mA. The achievable voltage range at high current output is limited by power rail headroom and maximum device power dissipation. Current ranges exceeding ±1.2 A or combinations of high current and high voltage can be achieved by paralleling or combining multiple DPS devices. Open-drain alarm outputs are provided for overcurrent and over-temperature conditions, or Kelvin alarms on the SENSE and DUTGND lines.

The DPS functionality is controlled via a simple 3-wire serial interface compatible with SPI, QSPI, MICROWIRE, and DSP interface standards, with interface clock speeds up to 50 MHz.

Features

• Programmable Device Power Supply (DPS) FV, MI, MV, FNMV functions
• 5 internal current ranges (on-chip RSENSE): ±5 μA, ±25 μA, ±250 μA, ±2.5 mA, ±25 mA
• 2 external high-current ranges (external δRSENSE): EXTFORCE1: ±1.2 A (max), EXTFORCE2: ±500 mA (max)
• All integrated programmable levels use 16-bit DACs: Drive DAC, Comparator DAC, Clamp DAC, Bias DAC, OSD DAC, DGS DAC
• Programmable Kelvin clamp and alarm
• On-chip integrated bias and gain correction registers
• Drive DAC with adjustable power supply ramp slew rate
• Programmable slew rate: 1 V/μs to 0.3 V/μs
• DUTGND Kelvin sensing and alarm
• 25 V FV span, asymmetric operation within −22 V to ±25 V range
• On-chip integrated comparator
• GANG mode: multiple devices can be combined for higher current output
• Guard drive amplifier
• System PMU connection support
• Current clamp
• On-chip temperature sensor with shutdown function
• On-chip integrated diode temperature sensing array
• Internal node access via diagnostic registers
• Open-drain alarm flags (temperature, current clamp, Kelvin alarm)
• SPI/MICROWIRE/DSP-compatible interface
• 64-pin (10 mm×10 mm) TQFP package with exposed pad (top)
• 72-pin (8 mm×8 mm) flip-chip BGA package

Applications

• Automatic Test Equipment (ATE) device power supply