مدار مجتمع (آی سی) آی سی‌کاربرد ویژه

Product Attributes

Introduction

TX7316 is a highly integrated, high-performance transmitter solution for ultrasound imaging systems. The device features 16 pulser circuits (PULS) and 16 transmit/receive (T/R) switches, supporting both on-chip and off-chip beamformers (TxBF). The device also integrates an on-chip floating power supply to reduce the number of required high-voltage power supplies. TX7316 incorporates a pulser circuit capable of generating three-level high-voltage pulses (up to ±100V) to excite multiple channels of ultrasound transducers. The device supports 8 outputs (for five-level mode) and 26 outputs (for three-level mode). The maximum output current is configurable from 2.4A to 0.6A. When the pulser generates high-voltage pulses, the T/R switches in the off state protect the receiver circuitry by providing high isolation between the high-voltage transmitter and low-voltage receiver. When the transducer receives echo signals, the T/R switches turn on and connect the transducer to the receiver. The on/off operation of the T/R switches can be controlled by external pins or by the on-chip beamforming engine built into the device. The T/R switches provide an impedance of 12Ω in the on state. Ultrasound transmission relies on excitation delay profiles across different elements to define the transmission direction, exciting multiple transducer elements simultaneously. This operation is referred to as transmit beamforming. TX7316 supports interleaved pulsing across different channels to enable transmit beamforming. The device supports both off-chip and on-chip beamforming operation. In off-chip beamformer mode, the output transitions of each pulser and the on/off operation of the T/R switches can be controlled by external control pins. To eliminate the effects of jitter on external control signals, the device supports a synchronization function. When synchronization is enabled, a low-jitter beamformer clock signal is used to latch the external control signals. In on-chip beamformer mode, the delay profiles for pulses across different channels are stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock cycle, with a maximum delay of 2^13 beamformer clock cycles. An internal pattern generator produces output pulse patterns based on the pattern profiles stored in the profile RAM. The profile RAM can store up to 16 beamforming profiles and 48/28 pattern profiles (for three-level and five-level modes, respectively). On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device. TX7316 is available in a 216-pin 15mm×10mm NFBGA package (ZCX package), rated for an operating temperature range of 0°C to 70°C.

Features

• Transmitter support: 16-channel tri-level or 8-channel five-level pulse generator and active transmit/receive (T/R) switch
• Ultra-low-power on-chip beamforming mode (five-level mode): receive-only mode: 17mW; T/R mode: 598mW; CW mode (0.6A mode): 1.97W; global power-down mode: 4.3mW
• Tri-level/five-level pulse generator: maximum output voltage: ±100V; minimum output voltage: ±1V; maximum output current: 2.4A to 0.6A; maximum clamp current: 1A to 0.25A (tri-level mode); maximum clamp current: 2A to 0.5A (five-level mode); second harmonic at 5MHz: –45dBc; CW mode jitter: 100fs measured at 100Hz to 20kHz; CW mode close-in phase noise: –154dBc/Hz at 5MHz signal (1kHz offset); 4.8A mode supported in five-level mode; –3dB bandwidth, 1kΩ ∥ 240pF load: 20MHz (±100V supply in 2.4A mode); 36MHz (±100V supply in 4.8A mode); 25MHz (±70V supply in 2.4A mode)
• Active T/R switch with: on/off control signal; on-resistance: 12Ω; bandwidth: 50MHz; HD2: –50dBc; turn-on time: 0.5μs; turn-off time: 1.75μs; transient glitch: 50mV_PP
• Off-chip beamformer with: jitter cancellation via sync function; maximum sync clock frequency: 200MHz
• On-chip beamformer with: delay resolution: one beamformer clock cycle, minimum 5ns; maximum delay: 2^13 beamformer clock cycles; maximum beamformer clock speed: 200MHz; on-chip RAM for storage — 16 delay profiles with 48/28 pattern profiles for tri-level and five-level modes respectively; high-speed (up to 100MHz) 1.8V and 2.5V CMOS serial programming interface
• Automatic thermal shutdown
• No specific power sequencing required in tri-level mode
• Compact package: NFBGA-216 (15mm × 10mm), 0.8mm pitch

Applications

• Ultrasonic imaging systems
• Piezoelectric actuator probes
• Integrated ultrasonic imaging