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Product Attributes

Introduction

The CIPOS module family offers the chance for integrating various power and control components to increase reliability, optimize PCB size and system costs. It is designed to enhance the system efficiency by improvement of power factor. The package concept is specially adapted to power applications, which need good thermal conduction and electrical isolation, but also EMI-save control and overload protection. TRENCHSTOP 5 are combined with an optimized SOI gate driver for excellent electrical performance.

Features

• Dual In-Line molded module
• TRENCHSTOP 5 Rapid switching emitter controlled diode
• Rugged SOI gate driver technology with stability against transient
• Over current shutdown
• Under-voltage lockout
• All of 3 switches turn off during protection
• Temperature monitor
• Emitter pins accessible for all phase current monitoring (open emitter)
• Lead-free terminal plating; RoHS compliant
• Very low thermal resistance due to DCB

Applications

• 3-Phase Interleaved PFC