حفاظت مدار وریستور (ام او وی)

Product Attributes

Introduction

This product utilizes advanced packaging technology with encapsulation materials compliant with UL94-V0 standards. Its compact, space-saving form factor delivers excellent performance in high-temperature and high-humidity environments, along with robust suppression of high-surge inrush currents. The SMD molded package is compatible with lead-free reflow soldering and wave soldering automated assembly processes. The product meets RoHS, REACH, and halogen-free requirements, and has obtained safety certifications including CQC, UL, and TUV.

Features

• Advanced packaging process; packaging materials compliant with UL94-V0
• Compact design, small footprint, space-saving
• Excellent high-temperature and high-humidity performance
• Superior high-surge current suppression capability
• SMD overmolded package; compatible with lead-free reflow/wave soldering automated assembly
• RoHS, REACH compliant; halogen-free
• CQC, UL, TUV safety certified

Applications

• LED power supplies
• Industrial equipment
• Communications equipment
• Automotive electronics
• Security circuits