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Product Attributes

Introduction

Fast-Response Surface-Mount Fuses

• Operating Temperature Range: -55°C to +125°C
• Current Rating: 8.0 A
• Voltage Rating: 24 VDC
• Nominal Cold DC Resistance: 0.008 Ω (measured at ≤10% rated current and 25°C ambient temperature)
• Clearing Time Characteristics (Fast Response):
  • 100% Rated Current: 4 hours (minimum)
  • 250% Rated Current: 5 seconds (maximum)
  • 400% Rated Current: 0.05 seconds (maximum)
• Interrupting Capacity: 8.0A, 45A at rated voltage
• Marking (Optional): Black marking character code, 8.0A: R
• Certification Body: Recognized by Underwriters Laboratories Component Program, File Number: E232989
• Shape and Dimensions (inches (mm)):
  • Dimensions: 1206 (3216)
  • L: 0.126±0.008 (3.20±0.20)
  • W: 0.063±0.008 (1.60±0.20)
  • T: 0.043±0.008 (1.10±0.20)
  • BW: 0.020±0.010 (0.51±0.25)
• Product Identification:
  • Series Code: F - Surface-Mount Fuse
  • Size Code: 1206 - L x W (inches)
  • Characteristic Code: FA - Fast Response
  • Current Rating Code: 8000 - 8000 mA
  • Voltage Rating Code: V024 - 24 VDC
  • Packaging Code: T - Tape and Reel Packaging, B - Bulk Packaging
  • Marking Code: M - With Marking
• Features:
  • Multi-layer monolithic structure with glass ceramic body and silver fuse element
  • Silver terminals with nickel and lead-free solder plating for excellent soldering performance
  • Compatible with wave soldering and reflow soldering processes
• Typical Applications:
  • Consumer Electronics: CD-/LD- Disc Drives, Portable Devices (Drives)
  • Communication Technology: ISDN Line Card Protection, PCM Cards, Mobile Phone Tuning Inputs, Satellite Receivers, Cards in GSM Base Stations
  • Data Processing: Disk Drives, Keyboard/Mouse Ports, LAN/PC Cards, Modems
  • Measurement and Control Technology: Communication Ports, Measurement Inputs/Probes/Sensors, Analysis Units, PLCs
  • Medical Technology: Communication Ports, Measurement Input/Output Probes
  • Power Supply Technology: Low-Voltage Section of Power Supplies/Chargers
• Temperature Derating Guide: Ambient temperature affects the current-carrying capacity of the fuse. When the fuse operates at temperatures above 25°C, "derating" should be performed according to the derating curve.
• Recommended PCB Pad Pattern:
  • Chip Size: 1206 (3216)
  • L: 0.173 (4.40 mm)
  • G: 0.059 (1.50 mm)
  • H: 0.071 (1.80 mm)
• Recommended Conditions for Manual Soldering:
  • Appropriate Soldering Iron Tip Temperature (maximum)/Soldering Time (maximum): 280°C/10 seconds or 350°C/3 seconds
  • It is highly recommended to use a hot air rework station that can melt the solder on both terminals simultaneously. Do not let the soldering iron tip directly contact the chip terminals.
• Packaging:
  • Surface-mount chip fuses are available in tape and reel packaging for automatic pick-and-place machines or in bulk packaging for special applications. Both tape and reel and bulk products are sealed in plastic bags with desiccants. The reel size is 7 inches.
• Tape Dimensions (inches (mm)):
  • Dimensions: 1206 (3216)
  • Ao: 0.071±0.004 (1.80±0.10)
  • Bo: 0.138±0.004 (3.50±0.10)
  • Ko: 0.050±0.004 (1.27±0.10)
  • Type: Plastic
• Quantity per Reel:
  • Chip Size: 1206 (3216)
  • Number of Parts on a 7-inch (178 mm) Reel: 3,000
• Storage:
  • Maximum Ambient Temperature: 35°C
  • Maximum Relative Humidity: 75%
  • The product should not be stored in an environment containing harmful gases such as sulfur or chlorine.

Features

• Mutilayer monolithic structure with glass ceramic body and silver fusing element
• Silver termination with nickel and solder plating (lead free), providing excellent solderability
• Compatible with both wave and reflow soldering processes

Applications

• Consumer Electronics, e.g. CD-/LD-Disc drives, portable sets (drives)
• Communication Technology, e.g. ISDN-line card protection, PCM-cards, mobile phones tuner input, satellite receivers, cards in GSM-base stations
• Data-Processing, e.g. disc drives, keyboard/mouse ports, LAN-/PC-cards, modems
• Measurement and Control Technology, e.g. communication ports, measurement inputs/ probes/sensors, analysis units, PLCs
• Medical Technology, e.g. communication ports, measurement in & out probes
• Power Supply Technology, e.g. low voltage section of power-supplies/chargers