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HYNIX H9HCNNNBKUMLXR-NEE

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HYNIX H9HCNNNBKUMLXR-NEE

Manufacturer HYNIX
Mfr. Part Number H9HCNNNBKUMLXR-NEE
Electland Part Code 1026593
Electland Part Number NYE_H9HCNNNBKUMLXR-NEE
Category Memory (ICs)
Description 16Gbit 4.266GHz LPDDR4 SDRAM FBGA-200(10x15) Memory (ICs) RoHS

Product Attributes

Category Integrated Circuits (ICs) Memory Memory (ICs)
Operating Temperature -25℃~+85℃
Voltage - Supply 7mA;1.06V~1.17V;1.7V~1.95V
Features Auto self-refresh;Auto precharge function;Asynchronous reset function;Write leveling function;ZQ calibration function
Clock Frequency 4.266GHz
Memory Size 16Gbit
Memory Format LPDDR4 SDRAM
Refresh Current 330uA
Packaging FBGA-200(10x15)
Weight 0.125g

Introduction

LPDDR4-SDRAM is a high-speed synchronous DRAM device internally configured with either 1 or 2 channels. Single-channel is comprised of 8-banks with from 1 Gb to 16 Gb per channel density. Dual-channel is comprised of 8-banks with from 2 Gb to 32 Gb per channel density. LPDDR4 devices use multi cycle of single data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. The 6-bit CA bus contains command, address and bank information. Each command uses two clock cycles, during which command information is transferred on positive edge of the corresponding clock. These devices also use a double data rate architecture on the DQ pins to achieve high speed operation. The double data rate architecture is essentially an 16n prefetch architecture with an interface designed to transfer two data bits per DQ every clock cycle at the I/0 pins. Read and write accesses to the LPDDR4 SDRAMs are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Prior to normal operation, the LPDDR4 SDRAM must be initialized.

Features

  • VDD1 = 1.8V (1.7V to 1.95V)
  • VDD2 = 1.1V (1.06V to 1.17V)
  • VDD2, VDDCA and VDDQ = 1.1V (1.06 to 1.17)
  • VSSQ terminated DQ signals (DQ, DQS_t, DQS_c, DMI)
  • Single data rate architecture for command and address; all control and address latched at rising edge of the clock
  • Double data rate architecture for data Bus; two data accesses per clock cycle
  • Differential clock inputs (CK_t, CK_c)
  • Bi-directional differential data strobe (DQS_t, DQS_c)
  • Source synchronous data transaction aligned to bi-directional differential data strobe (DQS_t, DQS_c)
  • DMI pin support for write data masking and DBIdc functionality
  • Programmable RL (Read Latency) and WL (Write Latency)
  • Burst length: 16 (default), 32 and On-the-fly; On the fly mode is enabled by MRS
  • Auto refresh and self refresh supported
  • All bank auto refresh and directed per bank auto refresh supported
  • Auto TCSR (Temperature Compensated Self Refresh)
  • PASR (Partial Array Self Refresh) by Bank Mask and Segment Mask
  • Background ZQ Calibration

In-Stock Suppliers

NoyanElectronic
1368 in stock
Supplier Part Number: NYE_H9HCNNNBKUMLXR-NEE

1 1
QTY USD TOMAN
1+$28.177,821,520 تومان
30+$26.697,410,590 تومان

Qty in reel: 120pcs/reel