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KIOXIA THGBMUG6C1LBAIL

Manufacturer	KIOXIA
Mfr. Part Number	THGBMUG6C1LBAIL
Electland Part Code	1026417
Electland Part Number	NYE_THGBMUG6C1LBAIL
Category	Memory (ICs)
Description	FLASH - NAND Memory IC 64Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)

Product Attributes

Category	Integrated Circuits (ICs) Memory Memory (ICs)
Package / Case	153-WBGA
Mounting Type	Surface Mount
Operating Temperature	-25℃~+85℃
Technology	FLASH - NAND
Voltage - Supply	2.7V ~ 3.6V
interface	eMMC 5.1
Features	Built-in wear leveling function;Bad block management function;ECC error correction function
Clock Frequency	200 MHz
Memory Size	8GB
Supplier Device Package	153-BGA (11.5x13)
Memory Type	Non-Volatile
Memory Format	FLASH
Memory Organization	8G x 8
Memory Interface	eMMC_5.1
Controller Operating Voltage (VCCQ)	1.7V~1.95V;2.7V~3.6V
Packaging	BGA-153(13X11.5)
Tariff Active	True
ReachStatus	REACH Unknown
RohsStatus	Unknown
MoistureSensitivityLevel	3 (168 Hours)
ExportControlClassNumber	3A991B1A
HtsusCode	8542.32.0071
Weight	0.2725g

Introduction

KIOXIA’s broad, high-performance lineup of e-MMC products integrates flash memory and an e-MMC controller in a single BGA package to perform functions such as error correction, wear leveling, logical-to-physical address translation, and bad-block management. These solutions support a high-speed memory interface compliant with JEDEC Version 5.0/5.1 and eliminate the need for the host to directly control the flash memory. e-MMC remains an important solution for many applications that are not able to migrate to the latest generation UFS, either because the densities needed are at the lower GB range, or because the processor does not yet support a UFS interface. Fabricated with solutions that utilize either 15nm process technology or more advanced BiCS FLASH 3D flash memory, e-MMC products are well-suited for a wide range of applications that continue to need e-MMC as an embedded memory solution.